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PAD LAYOUT
The following pad layout diagram is designed to facilitate both hand and
automated assembly.
0.065"
0.610"
0.070"
0.100"
Figure 14: Recommended PCB Layout
PRODUCTION GUIDELINES
The modules are housed in a hybrid SMD package that supports hand or
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring the
reliable function of the modules. The following procedures should be reviewed
with and practiced by all assembly personnel.
HAND ASSEMBLY
Pads located on the bottom of the
module are the primary mounting
surface. Since these pads are
inaccessible during mounting,
castellations that run up the side of
the module have been provided to
facilitate solder wicking to the
Soldering Iron
Tip
Solder
module’s underside. This allows for
very quick hand soldering for
prototyping and small volume
PCB Pads
Castellations
production.
Figure 15: Soldering Technique
If the recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the board
pad and the castellation, then introduce solder to the pad at the module’s edge.
The solder will wick underneath the module, providing reliable attachment. Tack
one module corner first and then work around the device, taking care not to
exceed the times listed below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Seconds
Hand-Solder Temp. RX +225°C for 10 Seconds
Recommended Solder Melting Point +180°C
Reflow Oven: +255°C Max. (See adjoining diagram)
Page 12
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